The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Lead-free solder has numerous undesirable characteristics, such as a higher melting point and reduced wetting than its leaded predecessor. These characteristics tend to produce more voids in solder ...

The ball grid array packaging industry continues to expand as the demand for high-performance denser type compact packaging continues to rise. Electronic devices such as smartwatches, smartphones, and ...