Abstract: Bond wire fatigue is a prominent problem in the reliability of IGBT modules and power electronic converter. The fatigue evaluation method of IGBT bond wire based on non-invasive methods has ...
Abstract: In this paper, 3-D finite element (FE) models were established to investigate the fatigue lives of bonding wire in different power packages in thermal cycling test. Meanwhile, three types of ...
Tested with the Robotdyn 16 Keys I2C Capacitive Touch TTP229 Module Robotdyn Capacitive Touch Disk Pad. uint16_t readKeys() - Read data from TTP229 and return states of 16 keys in bitmap ...
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