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RS, a global product and service solutions provider for industrial customers, have launched the DesignSpark PCB version 13.
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...
Discover the fundamentals of hybrid relays and explore why they are becoming a go-to choice for engineers and makers alike.
By teaching AI to read datasheets with human-level accuracy, Zenode accelerates part selection—the foundation of every printed circuit board ...
Abstract: This article presents a novel torque senor, which functions according to the deformation of a printed circuit board that carries sensitive elements and can also serve as a sensor. The ...
FLIP: Benchmark tasks in fitness landscape inference for proteins Christian Dallago, Jody Mou, Kadina E Johnston, Bruce Wittmann, Nick Bhattacharya, Samuel Goldman, Ali Madani, Kevin K Yang NeurIPS ...